Articron
Memory-Centric Computing

Empowering AI
for Every Need

Articron delivers memory-centric computing for next-gen AI chips — SRAM-CIM based NPU IP and ML-driven EDA automation with ultra-low power, minimal area, and maximum performance.

~20 TOPS/W
Power Efficiency
3.5 TOPS/mm²
Area Efficiency
5nm Ready
Process Node
8 Silicon Tape-outs
Chips Verified

Why Articron

Where AI Meets Silicon Efficiency

Purpose-built architecture and automation tools that give fabless teams a decisive edge in power, area, and speed.

2–6× better

Extreme Power Efficiency

Our SRAM-CIM architecture moves computation inside memory, eliminating costly data movement. The result: ~20 TOPS/W — far beyond industry averages.

3.5 TOPS/mm²

Compact Silicon Area

A dense IP footprint packs more compute into less die area, delivering 3.5 TOPS/mm² of area efficiency — a decisive advantage for SoC integration.

Weeks, not months

Faster Time-to-Market

Dalus, our ML-based SRAM automation engine, accelerates design cycles dramatically. Custom SRAM IP delivered at a pace traditional EDA tools cannot match.

8 verified chips

Silicon-Proven Reliability

Not just simulation — Articron has completed 8 actual silicon tape-outs. Our IPs are battle-tested across multiple process nodes and real-world workloads.

Partnered & Collaborated With

Samsung Electronics
DB HiTek
SK Keyfoundry
Telechips
ABOV Semiconductor
Hanwha Vision
Samsung Electronics
DB HiTek
SK Keyfoundry
Telechips
ABOV Semiconductor
Hanwha Vision
Samsung Electronics
DB HiTek
SK Keyfoundry
Telechips
ABOV Semiconductor
Hanwha Vision
Samsung Electronics
DB HiTek
SK Keyfoundry
Telechips
ABOV Semiconductor
Hanwha Vision
Get in Touch

Ready to Build Your
Next AI Chip?

Whether you need NPU IP integration, custom SRAM design, or EDA automation — Articron's team of semiconductor experts is ready to accelerate your project.