Articron
About Articron

Built by Experts,
For Memory-Centric Computing

Founded in 2023, Articron brings together deep semiconductor expertise to build the most efficient AI chip IP in the world.

Mission

Break the memory wall with memory-centric computing

AI is limited by one thing: memory. Moving data in and out of memory dominates power, area, and latency — making inference prohibitively expensive at the edge. Articron eliminates this bottleneck with memory-centric computing, bringing efficient intelligence from the smallest IoT sensor to the most demanding edge server.

Vision

AI intelligence embedded in every chip, everywhere

Today, intelligent AI lives in massive data centers — powered by chips only a handful of companies can build. We envision a future where that intelligence is embedded in every chip, everywhere: from the security camera to the autonomous vehicle. That world needs a new kind of silicon — one that's efficient enough to run anywhere, and accessible enough for any team to build.

Our Team

The People Behind Articron

Hanwool Jeong

Hanwool Jeong

CEO

Memory and Low-Power Semiconductor Circuit & Architecture Expert

Prof. Electrical and Electronic Engineering, Yonsei University

HW Engineer, Samsung Electronics

Seong-ook Jung

Seong-ook Jung

CTO

Memory and Low-Power Semiconductor Circuit & Architecture Expert

Prof. Electrical and Electronic Engineering, Yonsei University

Chief Designer, T-RAM Inc. (Silicon Valley)

HW Engineer, Samsung Electronics & Qualcomm

Bumsub Ham

Bumsub Ham

CTO

AI Algorithm & Deep Learning Expert

Prof. Electrical and Electronic Engineering, Yonsei University

Researcher, INRIA Paris

Dongkun Shin

Dongkun Shin

CTA

AI Semiconductor Processor & Compiler Expert

Prof. Computer Engineering, Sungkyunkwan University

SW Engineer, Samsung Electronics

Samsung Electronics Advisor

Mingu Kang

Mingu Kang

TAB

AI Accelerating Memory & System Design Expert

Prof. Electrical and Computer Engineering, UC San Diego

Researcher, Samsung Electronics & IBM TJ Watson Research

INTEL 2022 Rising Star Award

Our Journey

History

Apr 2026

Pre-A Funding

Pre-Series A round closed

Apr 2026

LPDDR6-PIM Platform

Awarded LPDDR6-PIM interface and runtime platform development project

Nov 2025

SRAM Supply Expansion

Additional SRAM supply contract signed with the same specialty foundry partner

Jul 2025

SRAM Compiler Contract

Puzzle (SRAM Compiler) supply contract signed with a specialty foundry partner

Apr 2025

SRAM Design Automation

Awarded development project for SRAM EDA tool

Apr 2025

SRAM-CIM IP MOU

MOU signed with a strategic partner for ART (SRAM-CIM IP) adoption

Jun 2024

5nm 3-Way NDA

5nm three-party NDA signed with a major foundry and design service partner for CIM verification chip fabrication

Jun 2024

4nm Foundry NDA

NDA signed with a top-tier foundry for 4nm process node collaboration

Jan 2024

CIM POC Chip #2

4-bit mixed CIM POC chip tape-out completed

Dec 2023

CIM POC Chip #1

8-bit mixed CIM / 4-bit analog CIM POC chip tape-out completed

Jul 2023

Deep-tech TIPS

Selected for deep-tech TIPS (fast-track program)

May 2023

Foundry NDA Signed

SRAM IP adoption discussion initiated with a leading foundry partner

Apr 2023

Government R&D Grant

Selected for university startup-focused national R&D program

Mar 2023

Seed Investment

University technology venture fund investment secured

Jan 2023

Company Founded

Articron established with a vision to democratize AI chip IP

Backed By

Our Investors

Yonsei Technology Holdings
Innopolis Partners
HB Investment