
Built by Experts,
For Memory-Centric Computing
Founded in 2023, Articron brings together deep semiconductor expertise to build the most efficient AI chip IP in the world.
Mission
Break the memory wall with memory-centric computing
AI is limited by one thing: memory. Moving data in and out of memory dominates power, area, and latency — making inference prohibitively expensive at the edge. Articron eliminates this bottleneck with memory-centric computing, bringing efficient intelligence from the smallest IoT sensor to the most demanding edge server.
Vision
AI intelligence embedded in every chip, everywhere
Today, intelligent AI lives in massive data centers — powered by chips only a handful of companies can build. We envision a future where that intelligence is embedded in every chip, everywhere: from the security camera to the autonomous vehicle. That world needs a new kind of silicon — one that's efficient enough to run anywhere, and accessible enough for any team to build.
Our Team
The People Behind Articron

Hanwool Jeong
CEOMemory and Low-Power Semiconductor Circuit & Architecture Expert
Prof. Electrical and Electronic Engineering, Yonsei University
HW Engineer, Samsung Electronics

Seong-ook Jung
CTOMemory and Low-Power Semiconductor Circuit & Architecture Expert
Prof. Electrical and Electronic Engineering, Yonsei University
Chief Designer, T-RAM Inc. (Silicon Valley)
HW Engineer, Samsung Electronics & Qualcomm

Bumsub Ham
CTOAI Algorithm & Deep Learning Expert
Prof. Electrical and Electronic Engineering, Yonsei University
Researcher, INRIA Paris

Dongkun Shin
CTAAI Semiconductor Processor & Compiler Expert
Prof. Computer Engineering, Sungkyunkwan University
SW Engineer, Samsung Electronics
Samsung Electronics Advisor

Mingu Kang
TABAI Accelerating Memory & System Design Expert
Prof. Electrical and Computer Engineering, UC San Diego
Researcher, Samsung Electronics & IBM TJ Watson Research
INTEL 2022 Rising Star Award
Our Journey
History
Pre-A Funding
Pre-Series A round closed
LPDDR6-PIM Platform
Awarded LPDDR6-PIM interface and runtime platform development project
SRAM Supply Expansion
Additional SRAM supply contract signed with the same specialty foundry partner
SRAM Compiler Contract
Puzzle (SRAM Compiler) supply contract signed with a specialty foundry partner
SRAM Design Automation
Awarded development project for SRAM EDA tool
SRAM-CIM IP MOU
MOU signed with a strategic partner for ART (SRAM-CIM IP) adoption
5nm 3-Way NDA
5nm three-party NDA signed with a major foundry and design service partner for CIM verification chip fabrication
4nm Foundry NDA
NDA signed with a top-tier foundry for 4nm process node collaboration
CIM POC Chip #2
4-bit mixed CIM POC chip tape-out completed
CIM POC Chip #1
8-bit mixed CIM / 4-bit analog CIM POC chip tape-out completed
Deep-tech TIPS
Selected for deep-tech TIPS (fast-track program)
Foundry NDA Signed
SRAM IP adoption discussion initiated with a leading foundry partner
Government R&D Grant
Selected for university startup-focused national R&D program
Seed Investment
University technology venture fund investment secured
Company Founded
Articron established with a vision to democratize AI chip IP
Backed By